SILICONE GAP-FILLER PAD TEL-XA-SI

Highly thermally conductive elastomer / Low Volatile Siloxanes (LV)
Silikon Gap-Filler Pad TEL-R-SI – Schwarzes, anisotrop leitendes Hochleistungs-Gap-Filler-Material (15 W/mK) für effiziente Wärmeableitung in Leistungselektronik.

TEL-XA-SI is a non dielectric, thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks even over large gaps or big tolerances.Through the specific formulation and filling with highly thermally and electrically conductive particles an extraordinary high anisotropic thermal conductivity is reached. Its conformal surface structure and high softness guarantee a very good compliance to the contact surfaces at low pressure. Thus the total thermal resistance is minimised.

EIGENSCHAFTEN
  • High surface compliance and softness
  • Low volatile siloxane (LV) ≤ 70 ppm
  • Thermal conductivity: 12 1/ 20 2 W/mK (anisotropic)
  • Non dielectric
  • Extraordinary chemical resistance and longterm stability
  • Shock absorbing

1 ASTM D 5470
2 Internal Methode

LIEFERFORMEN
  • Sheet 150 x 150 mm (Thickness < 2.0 mm)
  • Sheet 140 x 140 mm (Thickness ≥ 2.0 mm)
  • Double-side self tacky (TEL-XAXXXX-SI)
  • Die cut parts
  • Kiss cut parts on sheet
ANWENDUNGSBEISPIELE

Thermal link of:

  • MOSFETs or IGBTs
  • Power diodes or AC/DC converters
  • Power modules

For use in Switch mode power supplies / Motor control units / Automotiven engine management systems /UPS units / Solar systems

AUF EINEN BLICK
EigenschaftEinheitTEL-XA0500-SITEL-XA1000-SI
MaterialSilikon mit thermisch hoch leitenden FüllernSilikon mit thermisch hoch leitenden Füllern
FarbeGrauGrau
Dickemm0,50±0,051,0±0,10
Dichteg/cm22,22,2
HärteShore 005555
EntflammbarkeitUL 94V0V0
RoHS Konformität2015 / 863 / EUJaJa
Thermisch
Widerstand1 @ 100 kPa @ Dicke°C-inch²/W (mm)0,16 (0,42)0,19 (0,70)
Widerstand1 @ 50 kPa @ Dicke°C-inch²/W (mm)0,18 (0,45)0,21 (0,84)
Widerstand1 @ 20 kPa @ Dicke°C-inch²/W (mm)0,20 (0,48)0,24 (0,95)
Thermal Conductivity
ASTM D 5470
W/mK1212
Thermal Conductivity
Internal Methode
W/mK2020
Betriebstemperaturbereich°C- 40 bis + 150- 40 bis + 150

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