POTTING GEL

A thermally conductive potting gel is a self-levelling two-part compound that flows around electronic components to fill all gaps and cavities without applying permanent pressure. After curing through addition cross-linking, it forms a stable thermally conductive and electrically insulating encapsulation that protects components from vibration, moisture and mechanical stress while dissipating heat to the housing or heat sink.

Silicone potting gels offer excellent temperature stability (typically -50°C to +200°C), flexibility after curing and chemical resistance — making them the standard for automotive and high-temperature power electronics. Polyurethane (PU) potting gels provide higher adhesive strength and better resistance to hydrolysis — preferred for applications where mechanical bonding and moisture protection are the primary requirements.

Potting gels are pressure-free — they flow around components and cure in place, fully encapsulating the assembly. Gap fillers require mechanical compression to achieve thermal contact and do not encapsulate. Potting gels are the right choice when full encapsulation, vibration protection or moisture sealing is required alongside thermal conductivity.

HALA potting gels achieve thermal conductivities up to 3.5 W/mK. They are available in low to high viscosity grades to suit different dispensing systems and application geometries. For higher thermal conductivities without encapsulation, silicone gap fillers reach up to 20 W/mK.

Potting gels are used wherever complete encapsulation of electronics is required: power converters and inverters, battery management systems in e-mobility, power modules, LED drivers and industrial control units exposed to vibration or harsh environments. Request a free sample.