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Power Modules Data Sheet 
Sample Order Effective Thermal Management for Power Modules
In power electronics with MOSFETS and IGBTs, and especially with advanced SiC (silicon carbide) and GaN (gallium nitride) chips, efficient thermal management is of paramount importance. Power dissipation occurs due to electrical resistance and switching losses in semiconductor chips. It is important to manage this thermal power effectively to avoid excessive temperatures.
MODULES WITH AND WITHOUT BASE PLATES
There are modules with base plates and DCB (Direct Copper Bonding), modules without base plates. Base plate modules have an additional copper layer that improves heat flow by spreading heat. In DCB modules, the ceramic circuit boards are made of aluminum oxide, carbide or silicon nitride, for example, and are lighter and more compact. A well-planned thermal path is required to dissipate the heat loss from the chips to the heat sinks, improving both the efficiency and lifetime of the chips.
For optimized heat flow, various thermal interface materials (TIM) can be used. These include thermal conductive pastes (TCP), Graphite Foils and phase change materials (PCM). PCMs wet the surfaces and change their aggregate state with increasing temperatures and provide effective heat dissipation.
HALA YOUR SPECIALIST
HALA specializes in thermal interface material (TIM) design-in and customized solutions. We believe that efficient thermal management further drives not only performance, but also sustainability of applications. Contact us to find out how we can improve your thermal management.
