SILICONE CAPS
- Minimized dielectric creeping distances due to all around insulation
- High mechanic stability
- Residue-free removal after use
FAQ
Thermally conductive silicone caps are all-around dielectric insulating caps that are slipped over electronic components — particularly TO-package semiconductors. Under pressure they conform to the contact surfaces, minimising the overall thermal resistance while providing all-around electrical insulation that reduces dielectric creepage distances to the heat sink. Silicone as the base material ensures long-term chemical stability and residue-free removal.
Silicone caps provide all-around insulation and are designed for cylindrical or irregular component housings such as TO packages — they enclose the component completely. Thermally conductive foils are flat sheets placed between planar component surfaces and heat sinks. Caps are the right solution when the component geometry requires full circumferential insulation rather than a flat interface.
HALA offers silicone caps suitable for different TO packages in various wall thicknesses. They are used in power electronics, automotive and aerospace industries wherever high dielectric creepage distance requirements, extreme component density and effective cooling must be achieved simultaneously.
Yes, Silicone caps from HALA are chemically resistant to most aggressive liquids and gases, mechanically stable against wear and bulging during extended use, and can be removed residue-free during rework or repair — making them the ideal solution for applications requiring serviceability.
Yes. HALA develops custom silicone cap solutions for specific package geometries and wall thicknesses on request. Contact HALA’s thermal management experts for a tailored solution and free sample.



