Analyse - HALA Contec GmbH & Co. KG

CFD SIMULATION – THERMAL MANAGEMENT CONSULTING

THERMAL SIMULATION

Computer simulations of the flow and heat transfer as well as the targeted selection of interface materials form the basis for the optimum cooling solution – specially tailored to your application.

Our Services

Evaluation and elaboration of cooling concepts
Analysis of existing simulation results
Thermal and fluid dynamic simulations with Ansys:
- From system to component level
- Distribution of air flow, air temperatures, pressures, temperatures of solids
- Fan operating points, pressure drops
Optimisation of flow pattern and heat transfer, heat sinks, fans
Failure mode and post mortem analysis
Product upgrading and redesign

BENEFITS

Rapid feasibility studies
Early problem identification
Cost-efficiency of simulation vs. product redesign
Easy variant analysis
Accelerated Time-to-Market and Design-to-Cost
Cost savings by avoiding expensive prototype production
Replacement of lengthy test series / tests by fast simulations

Platinenmodell zeigt Wärmeverteilung mit Farbskala in blauer Umgebung.

COMPARISON OF THE
CPU TEMPERATURE
OF A RASPBERRY PI

WITHOUT COOLING

3D Geländeplan zeigt Temperaturverteilung überbaut mit simulierten Luftströmen in urbaner Umgebung.

Dreidimensionales Diagramm zeigt Temperaturverteilung in einem Raspberry Pi mit grafischen Markierungen.

COMPARISON OF THE
CPU TEMPERATURE
OF A RASPBERRY PI

WITH COOLING

ADDITIONAL OPTION OF FEM SIMULATION

Determination of thermal expansion, CTE-Mismatch and thermally induced stress
Transient temperature distribution during heating or cooling
Detection of gap formation and reduction of heat conduction contacts
Determination of stress due to blocked thermal expansion
Carrying out shock or vibration analyses using experimentally determined material data
Additionally: transport simulation and/or drop tests