TDG-W-SI-2C

TDG-W-SI-2C 2K Gap Filler dispensierbar

TDG-W-SI-2C is a 2-part dispensable low volatile silicone gap filler which is filled with thermally conductive fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact. Due to its negligible and controlled volatile content it is suited for environments where volatile silicones and paint wetting impairment are critical.

PROPERTIES
  • Dispensable 2-part silicone
  • Low volatile siloxane content (LV)
  • No paint wetting impairment
  • Thermal conductivity: 4.5 W/mK
  • Remains elastic after polymerisation
  • Zero stress on components
  • Heat accelerated curing
  • Shock absorbing
AVAILABILITY
  • Cartridges 2 x 25 ml / 2 x 100 ml /
    2 x 200 ml / 2 x 600 ml
  • Pail 2 x 25 kg
  • On request
APPLICATION EXAMPLES

Thermal link of:

  • FPBGA
  • Capacitors
  • Heat Pipes
  • BGA

For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs

OVERVIEW
PropertyUnitA-PartB-Part
MaterialSiliconeSilicone
ColourPinkWhite
Density @ 25 °Cg/cm³3.153.15
Mixing RatioWeight or Volume1 : 11 : 1
HardnessShore 005555
Viscosity (Brookfield @ 10 rpm, 25 °C)Pas250250
Viscosity (mixed) (Brookfield @ 10 rpm, 25 °C)Pas250250
Pot Life @ 25 °C and 65 % RHmin> 120> 120
Curing Time @ 25 °C / 100 °C (Time for viscosity to double)< 24 h / 15–30 min< 24 h / 15–30 min
Shelf Life (from Date of Manufacturing, unopened, @ < 35 °C)Months66
No Paint Wetting Impairment Substances (PWIS)1PassedPassed
UL FlammabilityUL 94V0 (≥ 0.15 mm)V0 (≥ 0.15 mm)
RoHS Conformity2015 / 863 / EUYesYes
Technical
Thermal Conductivity2W/mK4.54.5
Operating Temperature Range°C- 40 to + 150 - 40 to + 150
Dielectric StrengthkV/mm> 10> 10
Volume ResistivityOhm-cm> 1 x 1010> 1 x 1010

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