TDG-Y-SI-2C
CONTACT
DOWNLOAD TDG-Y-SI-2C Data Sheet
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TDG-Y-SI-2C is a 2-part dispensable low volatile LV silicone gap filler which is filled with thermally conductive fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact. Due to its negligible and controlled volatile content it is suited for environments where volatile silicones are critical.
PROPERTIES
- Dispensable 2-part silicone
- Low volatile siloxane content (LV)
- Thermal conductivity: 6 W/mK
- Remains elastic after polymerisation
- Zero stress on components
- Heat accelerated curing
- Shock absorbing
AVAILABILITY
- Cartridges 2 x 25 ml / 2 x 100 ml / 2 x 200 ml / 2 x 330 ml / 2 x 600 ml
- Pail 2 x 25 kg
- On request
APPLICATION EXAMPLES
Thermal link of:
- FPBGA
- Capacitors
- Heat Pipes
- BGA
For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs
OVERVIEW
| Property | Unit | A-Part | B-Part |
|---|---|---|---|
| Material | Silicone | Silicone | |
| Colour | Dark Blue | White | |
| Density @ 25 °C | g/cm³ | 3.4 | 3.4 |
| Mixing Ratio | Weight or Volume | 1 : 1 | 1 : 1 |
| Hardness | Shore 00 | 50 | 50 |
| Viscosity (Brookfield @ 10 rpm, 25 °C) | Pas | 350 | 350 |
| Viscosity (mixed) (Brookfield @ 10 rpm, 25 °C) | Pas | 350 | 350 |
| Pot Life @ 25 °C and 65 % RH (Time for viscosity to double) | min | > 60 | > 60 |
| Curing Time @ 25 °C | < 24 h | < 24 h | |
| Shelf Life (from Date of Manufacturing, unopened, @ < 35 °C) | Months | 6 | 6 |
| RoHS Conformity | 2015 / 863 / EU | Yes | Yes |
| Technical | |||
| Thermal Conductivity | W/mK | 6 | 6 |
| Operating Temperature Range | °C | - 40 to + 150 | - 40 to + 150 |
| Dielectric Strength | kV/mm | ≥ 10 | ≥ 10 |
| Volume Resistivity | Ohm-cm | ≥ 1 x 1010 | ≥ 1 x 1010 |
