TDG-Y-SI-2C

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TDG-Y-SI-2C is a 2-part dispensable low volatile LV silicone gap filler which is filled with thermally conductive fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact. Due to its negligible and controlled volatile content it is suited for environments where volatile silicones are critical.



PROPERTIES

  • Dispensable 2-part silicone
  • Low volatile siloxane content (LV)
  • Thermal conductivity: 6 W/mK
  • Remains elastic after polymerisation
  • Zero stress on components
  • Heat accelerated curing
  • Shock absorbing

AVAILABILITY

  • Cartridges 2 x 25 ml / 2 x 100 ml / 2 x 200 ml / 2 x 330 ml / 2 x 600 ml
  • Pail 2 x 25 kg
  • On request

APPLICATION EXAMPLES

Thermal link of:

  • FPBGA
  • Capacitors
  • Heat Pipes
  • BGA

For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs

OVERVIEW

PropertyUnitA-PartB-Part
MaterialSiliconeSilicone
ColourDark BlueWhite
Density @ 25 °Cg/cm³3.43.4
Mixing RatioWeight or Volume1 : 11 : 1
HardnessShore 005050
Viscosity (Brookfield @ 10 rpm, 25 °C)Pas350350
Viscosity (mixed) (Brookfield @ 10 rpm, 25 °C)Pas350350
Pot Life @ 25 °C and 65 % RH (Time for viscosity to double)min> 60> 60
Curing Time @ 25 °C< 24 h< 24 h
Shelf Life (from Date of Manufacturing, unopened, @ < 35 °C)Months66
RoHS Conformity2015 / 863 / EUYesYes
Technical
Thermal ConductivityW/mK66
Operating Temperature Range°C- 40 to + 150 - 40 to + 150
Dielectric StrengthkV/mm≥ 10≥ 10
Volume ResistivityOhm-cm≥ 1 x 1010≥ 1 x 1010