TGL-X-SI

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TGL-X-SI is an electrically insulating thermally conductive, highly viscuous dispensable form-in-place gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. The ready-made compound does not require an additional crosslinking process. Due to the specific formulation and filling with ceramic particles the material has a extremly high thermal conductivity. After dispensing the viscoplastic material leads to an optimum thermal contact at no pressure. By its use the total thermal resistance is minimised.



PROPERTIES

  • Dispensable
  • Almost zero pressure at assembly due to viscoplasticity
  • Thermal conductivity: 6.5 W/mK
  • Ready-made, no additional crosslinking required

AVAILABILITY

  • Cartridge 50 ml, 300 ml, 5 kg
  • Others on request

APPLICATION EXAMPLES

Thermal link of:

  • SMD packages
  • Through-hole vias
  • RDRAMs memory modules
  • Flip Chips, DSPs, BGAs, PPGAs

For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs / 5G Telecommunication equipment

OVERVIEW

PropertyUnitTGL-X-SI
MaterialCeramic filled silicone compound
ColourOrange
Densityg/cm³3.4
Flow rateg/s
g/min		≥30
3~4
Penetrationmm170
Shelf Life (from Date of Manufacturing, unopened, dry storage conditions @ < 40°C)Months6
Flammability (Equivalent)UL 94V0
RoHS Conformity2015 / 863 / EUYes
Thermal
Thermal ConductivityW/mK6.5
Operating Temperature Range°C- 40 to + 150
Electric
Dielectric StrengthkV / mm≥4.5
Volume ResistivityOhm - cm1,0 x 1014