TGL-X-SI
CONTACT
DOWNLOAD TGL-X-SI Data Sheet
SAMPLE ORDER
TGL-X-SI is an electrically insulating thermally conductive, highly viscuous dispensable form-in-place gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. The ready-made compound does not require an additional crosslinking process. Due to the specific formulation and filling with ceramic particles the material has a extremly high thermal conductivity. After dispensing the viscoplastic material leads to an optimum thermal contact at no pressure. By its use the total thermal resistance is minimised.
PROPERTIES
- Dispensable
- Almost zero pressure at assembly due to viscoplasticity
- Thermal conductivity: 6.5 W/mK
- Ready-made, no additional crosslinking required
AVAILABILITY
- Cartridge 50 ml, 300 ml, 5 kg
- Others on request
APPLICATION EXAMPLES
Thermal link of:
- SMD packages
- Through-hole vias
- RDRAMs memory modules
- Flip Chips, DSPs, BGAs, PPGAs
For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs / 5G Telecommunication equipment
OVERVIEW
| Property | Unit | TGL-X-SI |
|---|---|---|
| Material | Ceramic filled silicone compound | |
| Colour | Orange | |
| Density | g/cm³ | 3.4 |
| Flow rate | g/s g/min | ≥30 3~4 |
| Penetration | mm | 170 |
| Shelf Life (from Date of Manufacturing, unopened, dry storage conditions @ < 40°C) | Months | 6 |
| Flammability (Equivalent) | UL 94 | V0 |
| RoHS Conformity | 2015 / 863 / EU | Yes |
| Thermal | ||
| Thermal Conductivity | W/mK | 6.5 |
| Operating Temperature Range | °C | - 40 to + 150 |
| Electric | ||
| Dielectric Strength | kV / mm | ≥4.5 |
| Volume Resistivity | Ohm - cm | 1,0 x 1014 |
