TDG-Z10-SI-2C

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TDG-Z10-SI-2C is a 2-part dispensable low volatile LV silicone gap filler which is filled with thermally conductive fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact. Due to its negligible and controlled volatile content it is suited for environments where volatile silicones are critical.

PROPERTIES

Dispensable 2-part silicone
Low volatile siloxane content (LV)
Thermal conductivity: 10.0 W/mK
Remains elastic after polymerisation
Zero stress on components
Heat accelerated curing
Shock absorbing

AVAILABILITY

Cartridges 2 x 25 ml / 2 x 200 ml / 2 x 600 ml
Pail 2 x 25 kg

APPLICATION EXAMPLES

Thermal link of:

FPBGA
Capacitors
Heat Pipes
BGA

For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs

OVERVIEW

Property	Unit	A-Part	B-Part
Colour		Greenish Grey	Grey
Density @ 25 °C	g/cm³	3,30	3,30
Mixing Ratio	Weight or Volume	1 : 1	1 : 1
Hardness	Shore 00	50	50
Viscosity	Pas	180	160
Viscosity (mixed)	Pas	170	170
Pot Life @ 25 °C and 65 % RH (Time for viscosity to double)	Minutes	30 – 80	30 – 80
Curing Time @ 25 °C / 80 °C	Hours / Minutes	10 ±2 / ≥ 30	10 ±2 / ≥ 30
Shelf Life (from Date of Manu- facturing, unopened, dry storage conditions @ –15 – 35 °C)	Months	6	6
Flammability (Equivalent)	UL 94	V0	V0
RoHS Conformity	2015 / 863 / EU	Yes	Yes
Technical
Thermal Conductivity	W/mK	10	10
Operating Temperature	°C	- 40 to + 150	- 40 to + 150
Dielectric Strength	kV/mm	≥ 7	≥ 7
Volume Resistivity	Ohm-cm	≥ 1 x 10¹²	≥ 1 x 10¹²

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