TCR-D-SI-2C

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TCR-D-SI-2C Vergussmasse auf Silikonbasis

TCR-D-SI-2C is a 2-part addition cure silicone potting compound which is filled with thermally conductive fillers of high temperature stability. After curing the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for encapsulating electric and electronic parts such as transformators, capacitors, inductors, sensors, LEDs and can be moulded or dispensed at normal conditions at room temperature or in vacuum. Its rheologic behaviour allows for usage in geometries that are difficult to access.




PROPERTIES

  • Silicone
  • 2 part addition cure
  • Thermal conductivity: 0.68 W/mK
  • Remains elastic after curing
  • Almost zero stress on components
  • Dispensable or mouldable
  • High resistivity against water and humidity
  • Shock absorbing

AVAILABILITY

  • 2 kg / 40 kg (2 x 20 kg) AB Kit

APPLICATION EXAMPLES

Thermal link of:

  • Inductors
  • Capacitors
  • Heat Pipes
  • BGA

For use in Automotive applications / Telecommunication / Controlling units / Industrial PCs

OVERVIEW

PropertyUnitA-PartB-Part
MaterialSiliconeHardener
ColourBeigeBlack
Density @ 23 °Cg/cm³1.631.63
Mixing RatioWeight or Volume1 : 11 : 1
HardnessShore A4545
Viscosity (Brookfield)Pas66
Viscosity (Mixed) (Brookfield)Pas66
Tensile Strength (cured elastomer after 7 minutes @ 150 °C)psi252252
Elongation at Break (cured elastomer after 7 minutes @ 150 °C)%240240
Coefficient of Thermal Expansion (cured elastomer after 7 minutes @ 150 °C)
Volumetric1 x 10-6 /K650650
Linear1 x 10-6 /K217217
Pot Life @ 23 °C, 65 % rel. H.minca. 100ca. 100
Curing Time @ 25 °C / 100 °C24 h / 7 min24 h / 7 min
Shelf Life (from Date of Manufacturing, unopened, @ < 30 °C)Months2424
UL FlammabilityUL 94VOVO
RoHS Conformity2015 / 863 / EUYesYes
Technical
Thermal ConductivityW/mK0.680.68
Operating Temperature Range°C- 55 bis to 260 - 55 bis to 260
Dielectric StrengthkV/mm> 18> 18
Volume ResistivityOhm-cm4.02 x 10144.02 x 1014
Dielectric Constant@ 1 kHz3.083.08
Dissipation Factor@ 1 kHz0.0090.009