TPC-W-PC
CONTACT
DOWNLOAD TPC-W-PC Data Sheet
SAMPLE ORDER
TPC-W-PC is thermally conductive phase changing film optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change compound starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at very low pressure. The material is available as TPC-W-PC as free standing film or with different substrates thus reworkability is improved since no compound residues remain on one side.
PROPERTIES
- Optimal thermal contact
- Thermal conductivity: 3.5 W/mK
- Silicone-free
- Ideal alternative and replacement of messy thermal grease
- Different optional substrates allow for one-side residue-freeness and improved reworkability
AVAILABILITY
- Sheet 356 x 305 mm
- Roll 356 mm (Liner 394 mm ) x L
(up to 150 m) - TPC-WXXX-PC: Die cut parts
between 2 release liners - One-side coated substrates:
Aluminum TPC-WXXX-PC-ALYYY
Copper TPC-WXXX-PC-CUYYY
APPLICATION EXAMPLES
Thermal link of:
- MOSFETs or IGBTs
- Memory modules
- Power modules
- CPUs
For use in Servo drive control units / Computers / Automation appliances / Microelectronics
OVERVIEW
| Property | Unit | TPC-W100-PC | TPC-W200-PC | TPC-W300-PC |
|---|---|---|---|---|
| Material | Phase Change Film | Phase Change Film | Phase Change Film | |
| Colour | Grey | Grey | Grey | |
| Total Thickness | mm | 0,1±0,02 | 0,2±0,03 | 0,3±0,03 |
| Density | g/cm³ | 2.0 | 2.0 | 2.0 |
| RoHS Conformity | 2015 / 863 / EU | Yes | Yes | Yes |
| Thermal | ||||
| Resistances1 @ 150 PSI | °C-inch²/W | 0.0056 | 0.0061 | 0.0067 |
| Resistances1 @ 30 PSI | °C-inch²/W | 0.0097 | 0.0103 | 0.0111 |
| Resistance2 @ 10 PSI @ Thickness | °C-inch²/W | 0.0138 | 0.0148 | 0.0158 |
| Thermal Conductivity | W/mK | 3.5 | 3.5 | 3.5 |
| Phase Change Temperature | °C | ca. 45 | ca. 45 | ca. 45 |
| Storage | Months | 24 | 24 | 24 |
| Max. Storage Temperature | °C | 27 | 27 | 27 |
