TDG-Z8-SI-2C
CONTACT 
TDG-Z8-SI-2C is a 2-part dispensable silicone gap filler which is filled with thermally conductive
fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-
coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place.
It has a natural low level tack that enhances a good thermal contact.
PROPERTIES
- Dispensable 2-part silicone
- Thermal conductivity: 8.0 W/mK
- Remains elastic after polymerisation
- Zero stress on components
- Heat accelerated curing
- Shock absorbing
AVAILABILITY
- Cartridges 2 x 25 ml / 2 x 200 ml / 2 x 600 ml
- Pail 2 x 25 kg
APPLICATION EXAMPLES
Thermal link of:
- FPBGA
- Capacitors
- Heat Pipes
- BGA
For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs
OVERVIEW
| Property | Unit | A-Part | B-Part |
|---|---|---|---|
| Colour | Blue | White | |
| Density @ 25 °C | g/cm³ | 3,25 | 3,25 |
| Mixing Ratio | Weight or Volume | 1 : 1 | 1 : 1 |
| Hardness | Shore 00 | 65 | 65 |
| Viscosity | Pas | 200 | 180 |
| Viscosity (mixed) | Pas | 190 | 190 |
| Pot Life @ 25 °C and 65 % RH (Time for viscosity to double) | Minutes | 40 – 90 | 40 – 90 |
| Curing Time @ 25 °C / 80 °C | Hours / Minutes | 10 ±2 / 30 ±10 | 10 ±2 / 30 ±10 |
| Shelf Life (from Date of Manu- facturing, unopened, dry storage conditions @ –15 – 35 °C) | Months | 9 | 9 |
| Flammability (Equivalent) | UL 94 | V0 | V0 |
| RoHS Conformity | 2015 / 863 / EU | Yes | Yes |
| Technical | |||
| Thermal Conductivity | W/mK | 8 | 8 |
| Operating Temperature | °C | - 40 to + 150 | - 40 to + 150 |
| Dielectric Strength | kV/mm | ≥ 8 | ≥ 8 |
| Volume Resistivity | Ohm-cm | ≥ 1 x 1012 | ≥ 1 x 1012 |
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