TAD-G-SI-1C
CONTACT
DOWNLOAD TAD-G-SI-1C Data Sheet
SAMPLE ORDER
TAD-G-SI-1C is a liquid addition cure corrosion-free highly thermally conductive 1 part silicone adhesive. It cures at elevated temperature over 100°C to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. The adhesive features good thermal conductivity. It allows for being operated at temperatures up to 260°C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where high thermal conductivity, adhesion, fast curing and controlled, precision application are essential.
PROPERTIES
- Thermal conductivity: 1.38 W/mK
- High bonding properties
- Heat addition cure
- Non corrosive
- High operating temperatures up to 260°C
- Extraordinary chemical resistance and longterm stability
AVAILABILITY
- 1 kg jars
- Bulk packaging options on request
- Optional with glass beads
e.g. 0.2 mm (TAD-G-SI-1CG200)
APPLICATION EXAMPLES
- LED systems
- Processor cooling
- Memory chip assembly
- CPU board
OVERVIEW
| Property | Unit | TAD-G-SI-1C |
|---|---|---|
| Material | Silicone | |
| Colour | Grey | |
| Specific Gravity | g/cm³ | 2.06 |
| Linear Shrinkage | % | 2.0 |
| Viscosity | Pas | 43 |
| Hardness | Shore A | 67 |
| Tensile Strength | psi | 3.1 |
| Elongation | % | 70 |
| Curing Time (@ 100°C)) | min | 30 |
| Shelf Life (from Date of Manufacturing, unopened, @ < 15°C) | Months | 6 |
| Flammability (Equivalent) | UL 94 | HB (1.5 mm) |
| RoHS Conformity | 2015 / 863 / EU | Yes |
| Thermal | ||
| Thermal Conductivity | W/mK | 1.38 |
| Coefficient of Thermal Expansion Volumetric | x 10-6/K | 562 |
| Coefficient of Thermal Expansion linear | x 10-6/K | 187 |
| Operating Temperature Range | °C | - 50 to + 260 |
| Electric | ||
| Dielectric Strength | kV/mm | 22.5 |
| Volume Resistivity | Ohm - cm | 7.7 x 1015 |
| Surface Resistivity | Ohm - cm | 1.3 x 1015 |
