TAD-G-SI-1C

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TAD-G-SI-1C Silikonkleber thermisch leitfähig

TAD-G-SI-1C is a liquid addition cure corrosion-free highly thermally conductive 1 part silicone adhesive. It cures at elevated temperature over 100°C to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. The adhesive features good thermal conductivity. It allows for being operated at temperatures up to 260°C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where high thermal conductivity, adhesion, fast curing and controlled, precision application are essential.



PROPERTIES

  • Thermal conductivity: 1.38 W/mK
  • High bonding properties
  • Heat addition cure#
  • Self levelling
  • Non corrosive
  • High operating temperatures up to 260°C
  • Extraordinary chemical resistance and longterm stability

AVAILABILITY

  • 1 kg jars
  • Bulk packaging options on request
  • Optional with glass beads

APPLICATION EXAMPLES

  • LED systems
  • Processor cooling
  • Memory chip assembly
  • CPU board

OVERVIEW

PropertyUnitTAD-G-SI-1C
MaterialSilicone
ColourGrey
Physical stateFlowable
Specific Gravityg/cm³2.06
Linear Shrinkage%2.0
ViscosityPas43
HardnessShore A67
Tensile Strengthpsi3.1
Elongation%70
Curing Time (@ 100°C/120°C/150°C/175°C)min20–30 /15–20/10–15/1–5
Shelf Life (from Date of Manufacturing, unopened, @ < 15°C)Months6
Flammability (Equivalent)UL 94HB (1.5 mm)
RoHS Conformity2015 / 863 / EUYes
Thermal
Thermal ConductivityW/mK1.38
Coefficient of Thermal Expansion Volumetricx 10-6/K562
Coefficient of Thermal Expansion linearx 10-6/K187
Operating Temperature Range°C- 50 to + 260
Electric
Dielectric StrengthkV/mm22.5
Volume ResistivityOhm - cm7.7 x 1015
Surface ResistivityOhm - cm1.3 x 1015
Dielectric Constant6