HALA CLIPS
CONTACT PRODUCT DESCRIPTION
For optimum cooling, semiconductors, heat conducting materials and heat sinks must interact perfectly.
To achieve this, we develop individual solutions for our customers’ projects. Universal clamps are often used in this process because they create the maximum contact.
You can’t find the right one in our range yet? No problem – we will be happy to develop your customized solution. Contact us as your development partner.
ADVANTAGES
- Maximum thermal contact (even with min. component tolerances)
- Bending behaviour optimized by FE simulation
- Optimal interaction with HALA heat-conducting materials
- Assembly-friendly shape
- Easy chip identification through cut-outs
For optimal thermal contact between semiconductor and heat sink, HALA Clips are designed for use with thermally conductive foils, phase change materials and thin gap filler pads — all pre-appliable with defined bondline thickness.
Typical applications: power modules and power converters. Request a free sample or custom clip solution.
HALA CLIPS: SEMICONDUCTOR CLIPS
The universal clips in our range include two clips that are designed for use as semiconductors. Due to the special and registered design of the HALA clips, the spring forces act primarily on the outer areas of convex semiconductor housings. The effect: More thermal contact area and reduced thermal resistance.
FAQ
HALA Clips are FE simulation-optimised semiconductor clips that press semiconductors reliably and reproducibly against a heat sink. Their registered design directs spring forces primarily onto the outer areas of convex semiconductor housings — maximising the thermal contact area and reducing thermal resistance even with minimum component tolerances.
The thermal contact resistance between semiconductor and heat sink is strongly dependent on contact pressure. Insufficient pressure significantly increases thermal resistance and reduces cooling efficiency. FE simulation-optimised clips like HALA Clips ensure the optimal defined pressure for the respective thermal interface material — whether thermally conductive foil, phase change material or gap filler pad.
HALA Clips are currently available for TO-247 and TO-220 packages. For other package types, HALA develops customised clip solutions with FE-optimised bending behaviour on request. Contact our experts.
HALA Clips are optimised for use with HALA thermal interface materials: thermally conductive foils, phase change materials and thin gap filler pads are all suitable — all pre-appliable with defined bondline thickness for defined contact pressure.
Yes. HALA develops individual clip solutions for specific package forms and contact pressure requirements, optimised through FE simulation of the bending behaviour. Contact HALA’s experts for a customised solution and free sample.
