TCR-H-SI-2C is a 2-part addition cure silicone potting compound which is filled with thermally conductive fillers of high temperature stability. It is characterised by very good dielectric and mechanic properties and is suited for encapsulating electric and electronic parts such as transformators, capacitors, inductors, sensors, LEDs and can be moulded or dispensed under normal conditions at room temperature or in vacuum. Its rheologic behaviour allows for usage in geometries that are difficult to access.
PROPERTIES
Silicone
Low viscosity
2 part addition cure
Thermal conductivity: 1.2 W/mK
Almost zero stress on components
Dispensable or mouldable
Heat accelerated curing
High resistivity against water and humidity
Shock absorbing
AVAILABILITY
2 kg / 10 kg (2 x 5 kg) AB Kit
APPLICATION EXAMPLES
Thermal link of
Inductors
Capacitors
Heat Pipes
BGA
For use in Automotive applications / Telecommunication / Controlling units / Industrial PCs
OVERVIEW
Property
Unit
A-Part
B-Part
Material
Silicone
Hardener
Colour
Light grey
Orange
Physical state
Liquid
Liquid
Density @ 23 °C
g/cm³
2,2
2,2
Mixing Ratio
Weight or Volume
1 : 1
1 : 1
Hardness (7 days @ ~23 °C and 50% rel. F.)
Shore A
40
40
Viscosity (Brookfield)
Pas
2
1.9
Viscosity (Mixed) (Brookfield)
Pas
1,95
1,95
Tensile Strength (7 days @ ~23 °C and 50% rel. F.)
psi
117
117
Elongation at Break (7 days @ ~23 °C and 50% rel. F.)
%
30
30
Tear Strength (7 days @ ~23 °C and 50% rel. F.)
kN/m
4,56
4,56
Young Modulus (7 days @ ~23 °C and 50% rel. F.)
psi
722
722
Coefficient of Thermal Expansion (7 days @ ~23 °C and 50% rel. F.)
Volumetric
1 x 10-6 /K
402
402
Linear
1 x 10-6 /K
134
134
Linear Shrinking (7 days @ ~23 °C and 50% rel. F.)
%
0.03
0.03
Pot Life
min
ca. 50
ca. 50
Curing Time @ 25 °C / 100 °C
4 Stunden / 6 Minuten
4 Stunden / 6 Minuten
Shelf Life (from Date of Manufacturing, unopened @ < 30 °C)
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