TFO-S-CB
                                      TFO-S-CB consists of more than 98% pure natural graphite. Due to the flake-like shape they show anisotropic thermal conductivities in-plane (x-y-plane) and in through direction (z-direction). Their softness allows for a good compliance to the contact surfaces. Thus the total thermal resistance is minimised. Their low densities compared to copper (15%) or aluminium (50%) make them ideal for applications where low weight is required. The very high temperature resistance allows for the use in extreme hot environments.
- Maximum contact through good surface compliance
 - Very low weight
 - Silicone-free
 - Very high temperature resistance
 - EMI-shielding through high electrical conductivity
 
- Sheet 300 x 500 mm
 - Roll 300 mm x 50 m
 - Die cut parts
 - Non adhesive
(TFO-SXXX-CB) - Adhesive on one side
(TFO-SXXX-CB-A1) 
Thermal link of:
- CPUs to heat sinks
 - Power modules
 - Semiconductors
 - IGBTs
 
For use in Power inverters / Laptops / Automotive power supplies /Industrial PCs
| Property | Unit | TFO-S130-CB | TFO-S250-CB | TFO-S500-CB | 
|---|---|---|---|---|
| Material | Natural Graphite 98% | Natural Graphite 98% | Natural Graphite 98% | |
| Colour | Grey | Grey | Grey | |
| Thickness | mm | 0,13±0,03 | 0,25±0,03 | 0,5±0,05 | 
| Hardness | Shore A | 85 | 85 | 85 | 
| UL Flammability | UL 94 | V0 | V0 | V0 | 
| RoHS Conformity | 2015 / 863 / EU | Yes | Yes | Yes | 
| Thermal | ||||
| Resistances1 @ 150 PSI | °C-inch²/W | 0.06 | 0.10 | 0.16 | 
| Resistances1 @ 30 PSI | °C-inch²/W | 0.09 | 0.16 | 0.26 | 
| Resistance2 @ 10 PSI @ Thickness | °C-inch²/W | 0.12 | 0.24 | 0.40 | 
| Thermal Conductivity (Z Direction) | W/mK | 8 | 8 | 8 | 
| Thermal Conductivity (X-Y Direction) | W/mK | 140 | 140 | 140 | 
| Operating Temperature Range | °C | - 250 to + 400 | - 250 to + 400 | - 250 to + 400 | 
| Electric | ||||
| Volume Resistivity | Ohm - cm | 11.0 x 10-4 | 11.0 x 10-4 | 11.0 x 10-4 | 
| Dielectric Constant | @ 1 MHz | < 0,001 | < 0,001 | < 0,001 | 
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