TGL-U-NS

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TGL-U-NS is an electrically insulating thermally conductive, highly viscuous dispensable silicone-free form-in-place gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. The ready-made compound does not require an additional crosslinking process. Due to the specific formulation and filling with ceramic particles the material has a very high thermal conductivity. After dispensing the viscoplastic material leads to an optimum thermal contact at no pressure. By its use the total thermal resistance is minimised.




PROPERTIES

  • Dispensable
  • Almost zero pressure at assembly due to viscoplasticity
  • Thermal conductivity: 4.0 W/mK
  • Ready-made, no additional crosslinking required

AVAILABILITY

  • Cartridge 330 ml
  • Others on request

APPLICATION EXAMPLES

Thermal link of

  • SMD packages
  • Through-hole vias
  • RDRAMs memory modules
  • Flip Chips, DSPs, BGAs, PPGAs

For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs /
5G Telecommunication equipment

OVERVIEW

PropertyUnitTGL-U-NS
MaterialCeramic filled silicone-free compound
ColourGrey
Densityg/cm32.9
Viscosity (@ 0,5 1/s)
(@ 1,0 1/s)
Pas3,300
2,500
Shelf Life (unopened, dry storage conditions @ 5–30°C)Months6
UL Flammability (Equivalent)UL 94V0
RoHS Conformity2015 / 863 / EUYes
Thermal
Thermal ConductivityW/mK4.0
Operating Temperature Range°C- 40 to + 125
Electric
Dielectric StrengthkV / mm8
Volume ResistanceOhm - cm1.0 x 109
Dielectric Constant@ 500 MHz / @ 1 GHz8.98 / 8.88