Power Modules

Power modules with MOSFETs, IGBTs, SiC and GaN chips use phase change materials for the lowest thermal resistance at the chip-to-baseplate interface, graphite foils for lateral heat spreading from hot spots, thermally conductive silicone foils for electrically insulating substrate-to-heatsink bonding, and thermally conductive grease for very thin bondlines on flat surfaces.

Base plate modules have an additional copper layer that spreads heat before it reaches the heat sink — phase change materials or thermally conductive grease are typically applied at the base plate-to-heatsink interface. DCB baseless modules without a base plate place the ceramic circuit board directly against the heat sink, requiring electrically insulating TIMs such as thermally conductive foils or phase change films on polyimide carrier.

SiC and GaN chips operate at higher switching frequencies and power densities than conventional silicon IGBTs, generating more heat per unit area. Even small increases in junction temperature reduce efficiency and lifetime significantly. Optimal TIM selection at every interface in the thermal path — from chip to heat sink — is therefore critical for both performance and long-term reliability.

Graphite foils spread heat laterally from hot spots at up to 1,950 W/mK in-plane — preventing localised temperature peaks on the baseplate or heat sink. They are silicone-free, temperature resistant up to 400°C and available with dielectric laminate films or two-side phase change coating for combined spreading and bonding functionality.

Yes. HALA specialises in TIM design-in for specific power module applications — from material selection and thermal analysis through prototype sampling to series supply of custom die-cut parts. Contact HALA’s experts for a free consultation and sample.