PRODUCT OF THE MONTH – JANUAR 2026
Whether in 5G base stations, automotive electronics, high-performance graphicscards, industrialcomputers, or compact servers — wherever high power meets compact design, the TGF-Z15S-SI ensures efficient thermalmanagement and reliable heat dissipation. Our TGF-Z15S-SI is an electrically insulating gap filler made of silicone that scores with extremely high thermal conductivity of 15 W/mK – ideal when large gaps or different component heights need to be bridged. Thanks to its soft, plastic structure, it easily adapts to uneven surfaces and ensures optimal thermal contact and minimal contact resistance even with very low contact pressure.
Pre-applicable, easy to install, and flexible in use – for projects that expect high performance and temperature loads, we offer a particularly robust and efficient solution with this gap filler. Ready, your electronics deserve peak performance? Experience how TGF-Z15S-SI solves your thermal problems.
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