ADHESIVES
- Very low thermal resistances through excellent thermal contacts
- Reliable strong adherence on uneven or hardly machineable surfaces
- Excellent compensation of mechanic tolerances
- No need of mechanic fasteners e.g. screws, springs, clips
FAQ
Thermally conductive adhesives are one- or two-part bonding systems that simultaneously bond components mechanically and conduct heat from the component to the heat sink. Through their high bonding properties and thermal conductivity they minimise the thermal gradient while eliminating the need for mechanical fasteners such as screws, springs or clips. They cure at room temperature (RTV) or under heat.
1K adhesives (single-component) cure through moisture (RTV condensation curing) or heat — no mixing required, easy to apply from cartridges. 2K adhesives (two-component) are mixed from two components before application and cure through addition cross-linking — typically achieving higher final strength and faster cure times at room temperature.
Thermally conductive adhesives are the right choice when a permanent, non-reversible mechanical bond is required alongside thermal conductivity — particularly in compact, lightweight assemblies where screws or clips cannot be used. Gap fillers are preferred when the connection must remain releasable for maintenance or rework, or when larger gaps need to be bridged.
Silicone adhesives offer excellent temperature stability, chemical resistance and flexibility across a wide temperature range — the standard for high-temperature power electronics. Polyurethane adhesives provide higher adhesive strength, better resistance to hydrolysis and harder final cure — preferred where maximum mechanical bonding strength and moisture resistance are required.
Thermally conductive adhesives are used wherever compact design, weight limits and reliable thermal contact must be achieved without mechanical fasteners: power LED modules, power modules, thermo-electric modules, e-mobility power electronics and any application bonding materials with different coefficients of thermal expansion. Request a free sample or expert consultation.
