SILICONE CAPS

  • Minimized dielectric creeping distances due to all around insulation
  • High mechanic stability
  • Residue-free removal after use

PRODUCT DESCRIPTION

All-around dielectric insulating, thermally conductive caps and tubes provide excellent thermal transfer between electronic components and cooling surfaces. The all-round insulation minimizes dielectric creepage distances. Silicone as the base material makes them stable over the long term. They adapt to the contact surfaces under pressure, and the overall thermal resistance is minimized, depending on the applied pressure.

 

The caps and hoses made of silicone

are chemically resistant to most aggressive liquids and gases. They are mechanically stable to wear and tear or bulging during extended use and can be removed without residue during rework or repair.

The thermally conductive caps and tubes are available in a variety of sizes and shapes and are used in the power electronics, automotive, and aerospace industries, as well as in many other applications requiring effective cooling, very high dielectric and electrical creepage distance requirements, and with an extreme density of electronic components in a small package space.

/ SILICONE CAPS

Availability

  • Suitable for different TO packages
  • Different wall thicknesses

For flat planar interfaces, see our thermally conductive silicone foils or gap fillers. Typical applications: power modules and thermo-electric modules. Request a free sample.

FAQ

Thermally conductive silicone caps are all-around dielectric insulating caps that are slipped over electronic components — particularly TO-package semiconductors. Under pressure they conform to the contact surfaces, minimising the overall thermal resistance while providing all-around electrical insulation that reduces dielectric creepage distances to the heat sink. Silicone as the base material ensures long-term chemical stability and residue-free removal.

Silicone caps provide all-around insulation and are designed for cylindrical or irregular component housings such as TO packages — they enclose the component completely. Thermally conductive foils are flat sheets placed between planar component surfaces and heat sinks. Caps are the right solution when the component geometry requires full circumferential insulation rather than a flat interface.

HALA offers silicone caps suitable for different TO packages in various wall thicknesses. They are used in power electronics, automotive and aerospace industries wherever high dielectric creepage distance requirements, extreme component density and effective cooling must be achieved simultaneously.

Yes, Silicone caps from HALA are chemically resistant to most aggressive liquids and gases, mechanically stable against wear and bulging during extended use, and can be removed residue-free during rework or repair — making them the ideal solution for applications requiring serviceability.

Yes. HALA develops custom silicone cap solutions for specific package geometries and wall thicknesses on request. Contact HALA’s thermal management experts for a tailored solution and free sample.

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