Generated by Rank Math SEO, this is an llms.txt file designed to help LLMs better understand and index this website. # HALA Contec GmbH & Co. KG: HALA ## Sitemaps [XML Sitemap](https://www.hala-tec.com/sitemap_index.xml): Includes all crawlable and indexable pages. ## Produkte - [TGF-Z15S-SI](https://www.hala-tec.com/gap-filler-en/tgf-z15s-si/) - [TGF-Z12S-SI](https://www.hala-tec.com/gap-filler-en/tgf-z12s-si/) - [TGF-GXS-SI-A1](https://www.hala-tec.com/gap-filler-en/tgf-gxs-si-a1/) - [TGF-RUS-SI-A1](https://www.hala-tec.com/gap-filler-en/tgf-rus-si-a1/) - [TGF-Z12P-SI](https://www.hala-tec.com/gap-filler-en/tgf-z12p-si/) - [TGF-Z10P-SI](https://www.hala-tec.com/gap-filler-en/tgf-z10p-si/) - [TDG-Z10-SI-2C](https://www.hala-tec.com/gap-filler-en/tdg-z10-si-2c/) - [TDG-Z8-SI-2C](https://www.hala-tec.com/gap-filler-en/tdg-z8-si-2c/) - [TGF-VP-SI](https://www.hala-tec.com/gap-filler-en/tgf-vp-si/) - [TGF-VUS-SI-A1](https://www.hala-tec.com/gap-filler-en/tgf-vus-si/) - [TGF-W-SI](https://www.hala-tec.com/gap-filler-en/tgf-w-si/) - [TGF-YSP-SI](https://www.hala-tec.com/gap-filler-en/tgf-ysp-si/) - [TPC-Y-PC](https://www.hala-tec.com/phase-change-material-en/tpc-y-pc/) - [TGF-AXS-SI-GF](https://www.hala-tec.com/gap-filler-en/tgf-axs-si-gf/) - [TFO-R-SI](https://www.hala-tec.com/foils-films/tfo-r-si/) - [TGL-X-SI](https://www.hala-tec.com/gap-filler-en/tgl-x-si/) - [TGF-WP-SI](https://www.hala-tec.com/gap-filler-en/silikon-gap-filler-pad-plastic-soft/tgf-wp-si/) - [TGF-UP-SI](https://www.hala-tec.com/gap-filler-en/tgf-up-si/) - [TDG-Y-SI-2C](https://www.hala-tec.com/gap-filler-en/tdg-y-si-2c/) - [TAD-N-PU-2C](https://www.hala-tec.com/adhesive/tad-n-pu-2c/) - [TFO-Q-SI](https://www.hala-tec.com/foils-films/tfo-q-si-2/) - [TGF-NSS-NS](https://www.hala-tec.com/gap-filler-silicone-freee/tgf-nss-ns-2/) - [TGF-R-NS](https://www.hala-tec.com/gap-filler-silicone-freee/tgf-r-ns-2/) - [TGF-Y-NS](https://www.hala-tec.com/gap-filler-silicone-freee/tgf-y-ns/) - [TGF-IXS-NS](https://www.hala-tec.com/gap-filler-silicone-freee/tgf-ixs-ns/) - [TGF-V-NS](https://www.hala-tec.com/gap-filler-silicone-freee/tgf-v-ns/) - [TGF-W-NS](https://www.hala-tec.com/gap-filler-silicone-freee/tgf-w-ns/) - [TCR-H-SI-2C](https://www.hala-tec.com/potting-gel/tcr-h-si-2c/) - [TGF-LSS-SI](https://www.hala-tec.com/gap-filler-en/tgf-lss-si/) - [TGF-HUS-SI](https://www.hala-tec.com/gap-filler-en/tgf-hus-si/) - [TGF-M-SI](https://www.hala-tec.com/gap-filler-en/tgf-m-si/) - [TCP-L-SI](https://www.hala-tec.com/silicone-caps/tcp-l-si/) - [TFO-ZS-SI](https://www.hala-tec.com/foils-films/tfo-zs-si/) - [TEL-ZS-SI](https://www.hala-tec.com/gap-filler-en/tel-zs-si/) - [TO-247-1](https://www.hala-tec.com/hala-clips/to-247-1/) - [TO-220-1](https://www.hala-tec.com/hala-clips/to-220-1/) - [TGR-M-NS](https://www.hala-tec.com/grease/tgr-m-ns/) - [TGR-J-NS](https://www.hala-tec.com/grease/tgr-j-ns/) - [TAD-P-SI-1C](https://www.hala-tec.com/adhesive/tad-p-si-1c/) - [TAD-O-SI-1C](https://www.hala-tec.com/adhesive/tad-o-si-1c/) - [TAD-G-SI-1C](https://www.hala-tec.com/adhesive/tad-g-si-1c/) - [TFO-ZS-PG](https://www.hala-tec.com/graphite-film/graphite-film-pyrolytic/tfo-zs-pg/) - [TFO-Y-PG](https://www.hala-tec.com/graphite-film/graphite-film-pyrolytic/tfo-y-pg/) - [TFO-S-CB](https://www.hala-tec.com/graphite-film/graphite-film-anisotropic-heat-conductive/tfo-s-cb/) - [TEL-YSS-SI](https://www.hala-tec.com/gap-filler-en/tel-yss-si/) - [TEL-Z-SI](https://www.hala-tec.com/gap-filler-en/tel-z-si/) - [TEL-R-SI](https://www.hala-tec.com/gap-filler-en/tel-r-si/) - [TPC-T-AL-CB](https://www.hala-tec.com/phase-change-material-en/tpc-t-al-cb/) - [TPC-R-AL](https://www.hala-tec.com/phase-change-material-en/tpc-r-al/) - [TPC-W-PC](https://www.hala-tec.com/phase-change-material-en/tpc-w-pc/) ## Pages - [Declaration on accessibility for services](https://www.hala-tec.com/service-links/declaration-on-accessibility-for-services/) - [Products Overview](https://www.hala-tec.com/products/products-overview/) - [Career](https://www.hala-tec.com/company/career/) - [Home](https://www.hala-tec.com/) - [Contact](https://www.hala-tec.com/contact/) - [thermal interface materials](https://www.hala-tec.com/thermal-interface-materials/) - [About Hala](https://www.hala-tec.com/company/about-hala/) - [Heatpipe Assembly](https://www.hala-tec.com/applications/heatpipe-assembly/) - [THERMALLY CONDUCTIVE FOILS](https://www.hala-tec.com/thermally-conductive-foils/) - [THERMAL PADS](https://www.hala-tec.com/thermal-pads/) - [Product search](https://www.hala-tec.com/products/product-search/) - [SILICONE FREE](https://www.hala-tec.com/products/gap-filler/silicone-free/) - [SILICONE](https://www.hala-tec.com/products/gap-filler/silicone/) - [Meet our experts](https://www.hala-tec.com/services/meet-our-experts/) - [Internal area](https://www.hala-tec.com/service-links/internal-area/) - [Thermal Interface Materials for E-Mobility](https://www.hala-tec.com/applications/e-mobility/) - [Customer login](https://www.hala-tec.com/service-links/customer-login/) - [News](https://www.hala-tec.com/news/) - [Press Releases](https://www.hala-tec.com/downloads/press-releases/) - [Brochures](https://www.hala-tec.com/downloads/brochures/) - [Data Sheets](https://www.hala-tec.com/downloads/data-sheets/) - [Catalogue](https://www.hala-tec.com/downloads/catalogue/) - [Legal notice](https://www.hala-tec.com/service-links/legal-notice/) - [Privacy Policy](https://www.hala-tec.com/service-links/privacy-policy/) - [Imprint](https://www.hala-tec.com/service-links/imprint/) - [Sample Order](https://www.hala-tec.com/service-links/sample-order/) - [Service Links](https://www.hala-tec.com/service-links/) - [HEAT PIPES](https://www.hala-tec.com/products/heatpipe-systems/) - [ELECTRICAL INSULATING FILMS](https://www.hala-tec.com/products/electrical-insulating-films/) - [HALA CLIPS](https://www.hala-tec.com/products/hala-clips/) - [POTTING GEL](https://www.hala-tec.com/products/potting-gel/) - [ADHESIVES](https://www.hala-tec.com/products/adhesives/) - [THERMALLY CONDUCTIVE GREASE](https://www.hala-tec.com/products/thermally-conductive-grease/) - [SILICONE CAPS](https://www.hala-tec.com/products/silicone-caps/) - [PSA INSULATING TAPE](https://www.hala-tec.com/products/psa-insulting-tape/) - [GRAPHITE FOILS](https://www.hala-tec.com/products/graphite-foils/) - [PHASE CHANGE MATERIAL](https://www.hala-tec.com/products/phase-change-material/) - [SILICONE FOILS AND FILMS](https://www.hala-tec.com/products/thermally-conductive-foils/) - [GAP-FILLER](https://www.hala-tec.com/products/gap-filler/) - [Sales Partners](https://www.hala-tec.com/company/sales-partners/) - [Contact Persons](https://www.hala-tec.com/company/contact-persons/) - [Production](https://www.hala-tec.com/services/production/) - [Analyse](https://www.hala-tec.com/services/analyse/) - [Power Converters & Inverters](https://www.hala-tec.com/applications/power-converters/) - [Thermo-Electric Modules](https://www.hala-tec.com/applications/thermo-electric-modules/) - [Power Modules](https://www.hala-tec.com/applications/power-modules/) - [Power LED](https://www.hala-tec.com/applications/power-led/) - [Company](https://www.hala-tec.com/company/) - [Services](https://www.hala-tec.com/services/) - [APPLICATIONS](https://www.hala-tec.com/applications/) ## News - [PRODUCT OF THE MONTH – JULY 2026](https://www.hala-tec.com/news/product-of-the-month-july-2026/): When high power dissipation meets complex geometries and wide tolerances, traditional thermal pads aren’t always the best solution. That’s exactly where our TDG-Z10-SI-2C is a game changer. This dispensable, silicone-based two-component gap filler combines high thermal conductivity of 10.0 W/mK with excellent conformability. Thanks to its thixotropic behavior, the material can be applied precisely and cures directly at the desired position. This ensures reliable thermal contact even on non-planar surfaces or with large gap dimensions. - [PRODUCT OF THE MONTH – JUNE 2026](https://www.hala-tec.com/news/product-of-the-month-june-2026/): TDG-Z8-SI-2C is a dispensable, two-component, silicone-based gapfiller that we have developed specifically for demanding applications in modern thermal management. With its high thermal conductivity of 8.0 W/mK, the material ensures reliable heat dissipation – even with large tolerances and non-planar surfaces. - [PRODUCT OF THE MONTH – MAY 2026](https://www.hala-tec.com/news/product-of-the-month-may-2026/): TGF-Z12S-SI is our high-performance silicone gapfiller that truly shines when conventional thermalmanagement reaches its limits. With a thermal conductivity of 12 W/mK, it ensures extremely efficient heat dissipation—even with large gap dimensions and uneven components. Thanks to its soft, pliable structure, the material adapts perfectly to any surface and establishes reliable thermal contact even with very low contact pressure. This reduces the overall thermal resistance while simultaneously protecting sensitive components from mechanical stress. - [PRODUCT OF THE MONTH – APRIL 2026](https://www.hala-tec.com/news/product-of-the-month-april-2026/): Especially with sensitive components and large tolerances, the choice of the right material is crucial for efficient thermal management. - [NEW CATALOGUE 2026](https://www.hala-tec.com/news/new-catalogue-2026/): We are delighted to present our 2026 catalogue for thermal management and thermal interface materials. It offers a comprehensive overview of innovative thermal interface materials, thermal solutions for electronics and efficient heat dissipation systems. - [PRODUCT OF THE MONTH – MARCH 2026](https://www.hala-tec.com/news/product-of-the-month-march-2026/): Our TGF-BXS-SI is an ultra-soft, electrically insulating silicone gap filler with a thermal conductivity of 1.2 W/mK, which establishes efficient thermal contact between components and cooling structures even under minimal pressure. Thanks to its extreme softness and high conformability, it reliably closes larger gaps and tolerances – without any mechanical stress on the components. Its naturally adhesive material is very easy to pre-apply, and it is optionally available with a single-sided adhesive layer. - [We are celebrating our 20th anniversary!](https://www.hala-tec.com/news/we-are-celebrating-our-20th-anniversary/): For over two decades, we have stood for innovative technologies in thermal management and sustainable, future-oriented solutions. Since our founding, our goal has been not only to develop high-performance systems, but also to set new standards in efficiency, reliability, and environmental responsibility. Through continuous research, technological advancement, and close cooperation with our partners, we have been able to shape the evolution of our industry. - [PRODUCT OF THE MONTH – FEBRUARY 2026](https://www.hala-tec.com/news/product-of-the-month-february-2026/): Our TGF-Z10P-SI is an electrically insulating gapfiller made of silicone with extremely high thermal conductivity of 10 W/mK, which excels precisely where large gaps, tolerances, or different component heights create thermal challenges. Thanks to its soft, plastic form, it adapts perfectly to irregular surfaces, ensures excellent thermal contact even with low contact pressure, and thus minimizes heat transfer resistance. - [We are IATF 16949:2016 certified](https://www.hala-tec.com/news/we-are-iatf-169492016-certified/): Our production site in China has been successfully certified according to IATF 16949:2016, thus meeting one of the most demanding quality standards in the automotive industry. This step underlines our commitment to maximum process reliability, a zero-defect strategy and reliable delivery performance for our customers. We are pleased to announce that our site in China has successfully obtained IATF 16949:2016 certification! - [PRODUCT OF THE MONTH – JANUAR 2026](https://www.hala-tec.com/news/product-of-the-month-januar-2026/): Whether in 5G base stations, automotive electronics, high-performance graphicscards, industrialcomputers, or compact servers — wherever high power meets compact design, the TGF-Z15S-SI ensures efficient thermalmanagement and reliable heat dissipation. Our TGF-Z15S-SI is an electrically insulating gap filler made of silicone that scores with extremely high thermal conductivity of 15 W/mK – ideal when large gaps or different component heights need to be bridged. Thanks to its soft, plastic structure, it easily adapts to uneven surfaces and ensures optimal thermal contact and minimal contact resistance even with very low contact pressure. - [MERRY CHRISTMAS FROM ALL OF US](https://www.hala-tec.com/news/merry-christmas-from-all-of-us/): TOONDA is a Cultural Community Center in Uganda, supporting rural Ugandan communities through education, women empowerment, and arts & culture. - [PRODUCT OF THE MONTH – DECEMBER 2025](https://www.hala-tec.com/news/product-of-the-month-december-2025/): Our TGF-Z12S-SI is an electrically insulating gap filler pad based on silicone with extremely high thermal conductivity of 12 W/mK, and it really shines when large tolerances or uneven components make reliable thermal contact difficult. Thanks to its soft, plastic structure, it adapts perfectly to irregular surfaces and ensures efficient heat dissipation even with very low contact pressure. - [PRODUCT OF THE MONTH – NOVEMBER 2025](https://www.hala-tec.com/news/product-of-the-month-november-2025/): TGF-RUS-SI-A1 is our particularly soft silicone gapfiller, which adapts perfectly to uneven surfaces and large tolerances. At the same time, it ensures a secure thermal connection. Even with very low contact pressure, it ensures efficient thermalmanagement – without mechanical stress on the components. - [PRODUCT OF THE MONTH – OCTOBER 2025](https://www.hala-tec.com/news/product-of-the-month-october-2025/): When it comes to serious power and thermal management, our TGF-Z12P-SI steps up to the challenge. This electrically insulating, ultra–thermally conductive silicone gap filler bridges gaps and compensates for height differences with ease. Delivering an impressive thermal conductivity of 12 W/mK, combined with exceptional softness and adaptability, it ensures optimal heat transfer even under minimal compression – significantly lowering thermal resistance. - [PRODUCT OF THE MONTH – SEPTEMBER 2025](https://www.hala-tec.com/news/product-of-the-month-september-2025/): TDG-Y-SI-2C is a two-component siliconegapfiller with a thermal conductivity of 6 W/mK that adapts perfectly to uneven surfaces and large tolerances. A special feature: even after curing, it remains elastic and relieves stress on sensitive components – for reliable performance without thermal bottlenecks. - [PRODUCT OF THE MONTH – AUGUST 2025](https://www.hala-tec.com/news/product-of-the-month-august-2025/): For applications requiring low contact forces, large gap dimensions, or vibration-damping properties, we offer TGF-GXS-SI-A1 as a highly effective and cost efficient solution. Our ultra-soft silicone-based gap filler is equipped with ceramic fillers. This ensures reliable heat dissipation while providing high electrical insulation. - [PRODUCT OF THE MONTH – JULY 2025](https://www.hala-tec.com/news/product-of-the-month-july-2025-2/): Where conventional thermal interface materials reach their limits, TGF-Z10P-SI opens up new possibilities in thermalmanagement. The electrically insulating gap filler made of silicone-based elastomer combines exceptional thermal conductivity with high conformability – ideal for applications with irregular component geometries, large gaps, or low contact pressures. - [PRODUCT OF THE MONTH – JUNE 2025](https://www.hala-tec.com/news/product-of-the-month-june-2025/): When it comes to gentle pressure – in the truest sense of the word – our TGF-RUS-SI-A1 is exactly the right material: a particularly soft, surface compliable silicone-based gap filler that is ideal for large gaps, uneven surfaces or sensitive components. With a thermal conductivity of 3.0 W/mK, it ensures a reliable thermal connection even with very low contact pressure – without mechanically stressing electronic components. - [PCIM 2025 – HALA SHOWS INNOVATIONS IN THERMAL MANAGEMENT](https://www.hala-tec.com/news/pcim-2025-hala-zeigt-neuerungen-beim-waermemanagement/): The leading international trade fair for power electronics will once again take place in Nuremberg from May 6 – 8, 2025: PCIM. The focus there will be on professional exchange about new products, the latest trends and current research results. Our experts will be there to present HALA’s comprehensive expertise in optimizing thermal management solutions and thermal interfaces. At our stand 506 in the central Hall 7, visitors can find out about our current portfolio in the field of high-performance interface materials, innovative pyrolytic and phase change graphite solutions, heat pipe assemblies and pulsating heat pipes. - [PRODUCT OF THE MONTH – MAY 2025](https://www.hala-tec.com/news/product-of-the-month-may-2025/): Whether in high-end servers, 5G base stations, gaming rigs or PlayStations - wherever high performance is required, a lot of heat is generated. This means reliable thermalmanagement is not a nice-to-have, but a must! - [PRODUCT OF THE MONTH – APRIL 2025](https://www.hala-tec.com/news/product-of-the-month-april-2025-2/): Wherever things get hot – whether in #5G base stations, #automotive applications, #notebooks, #medicaltechnology or #industrialcomputers – you need a reliable #GapFiller that is not only thermally impressive, but also mechanically flexible. - [PRODUCT OF THE MONTH – MARCH 2025](https://www.hala-tec.com/news/product-of-the-month-march-2025/): Effective thermalmanagement  is crucial for ensuring the reliability, performance, and longevity of electronic components. Whether in smd technology, automotive, IT, medicaltechnology, or for cooling electronic components such as capacitors and inductioncoils managing heat efficiently is a key challenge — one that requires innovative materials designed for demanding applications. - [PRODUCT OF THE MONTH – February 2025](https://www.hala-tec.com/news/product-of-the-month-february-2025/): In today’s world of compact, high-performance electronics, rising operational temperatures are a given. Without effective thermalmanagement, reliability and lifespan take a serious hit. How do you ensure your components stay cool under pressure? - [PRODUCT OF THE MONTH – January 2025](https://www.hala-tec.com/news/product-of-the-month-january-2025/): In today’s cutting-edge electronic devices – whether laptops or medicalequipment – uneven gaps caused by varying component heights are a common challenge. Our TGF-VUS-SI-A1 low volatile siloxane gapfiller is the perfect solution: with a thermal conductivity of 5.0 W/mK and exceptional softness, it ensures optimal heat transfer with minimal pressure. - [PRODUCT OF THE MONTH – Dezember 2024](https://www.hala-tec.com/news/product-of-the-month-dezember-2024/): Say hello to TGF-VP-SI, the electrically insulating, highly thermally conductive gap filler that's designed to tackle even the most challenging thermal connections. With its silicone elastomer filled with ceramic powder, this gap filler effortlessly bridges large gaps caused by height differences or tolerances in electronic components, ensuring exceptional thermal conductivity. - [PRODUCT OF THE MONTH – November 2024](https://www.hala-tec.com/news/product-of-the-month-november-2024/): Meet TFO-S-CB, a cutting-edge foil made from over 98% pure natural graphite. With its unique flake-like structure, this material offers anisotropic thermal conductivity, providing exceptional heat transfer across the foil plane and in the perpendicular direction. Its excellent surface adaptability ensures an optimized thermal contact, significantly reducing overall thermal resistance. Plus, with a density just 15% that of copper and 50% of aluminum, TFO-S-CB is perfect for applications where weight  is a critical factor. - [PRODUCT OF THE MONTH – October 2024](https://www.hala-tec.com/news/product-of-the-month-october-2024/): Our TEL-YSS-SI gap filler is revolutionizing the thermal coupling of electronicpackages and heatsinks. With its exceptionally high anisotropic thermal conductivity of 16 W/mK and #excellent force-deflection properties, it effortlessly bridges even larger gaps and tolerances. The specially formulated LV silicone base ensures maximum performance with minimal pressure, significantly reducing the overall thermal resistance. - [PRODUCT OF THE MONTH – September 2024](https://www.hala-tec.com/news/product-of-the-month-september-2024/): Heatpipe assemblies as heat spreaders are at the heart of modern heatmanagement systems and are revolutionizing the way we conduct heat! - [PRODUCT OF THE MONTH – August 2024](https://www.hala-tec.com/news/product-of-the-month-august-2024/): With a thermalconductivity of 3.0 W/mK and its special formulation with ceramic powder, this gapfiller is perfect for thermal bonding across large gaps. Not only that - thanks to its extreme softness and conformability, it achieves optimum thermal contact even at extremely low pressure, which minimizes stress on the components and also the overall thermal transfer resistance at the same time. - [PRODUCT OF THE MONTH – July 2024](https://www.hala-tec.com/news/product-of-the-month-july-2024/): TFO-X-SI is no ordinary silicone foil - it is a high-performance engineering marvel that has been developed to perfection. With a special formulation and a filling of ceramic particles, it achieves an exceptional thermal conductivity of 5.0 W/mK, which ensures efficient thermalmanagement. The surface structure guarantees a perfect fit to the contact surfaces, minimizing the overall thermal resistance. - [PCIM 2024](https://www.hala-tec.com/news/pcim-2024/): Last week the PCIM took place in Nuremberg. The trade fair was once again a great success with a professional exchange about new products, the latest trends and current research results. We were there to present our thermal management solutions and thermal interfaces from HALA. We would like to thank everyone who visited us and are already looking forward to the next exciting discussions. - [PRODUCT OF THE MONTH – JUNE 2024](https://www.hala-tec.com/news/product-of-the-month-june-2024/): TGF-IXS-NS is a fantastic electricallyinsulating, thermally conductive and silicone-free gapfiller that enables excellent thermal connections across large gaps - ideal for height differences in electroniccomponents or large tolerances! - [Optimizing Thermal Interfaces by 2 Phase Technology and TIMs](https://www.hala-tec.com/news/optimizing-thermal-interfaces-by-2-phase-technology-and-tims/): The Power Electronics & Energy Storage event will take place on May 28, 2024. The focus there will be on professional exchange about new products and the latest trends. Our partner Batenburg will present its comprehensive expertise and product range. Under the motto "Smarter Focus. Brighter tomorrow" they develop intelligent solutions for industrial automation. - [PCIM 2024 – HALA SHOWS INNOVATIONS IN THERMAL MANAGEMENT](https://www.hala-tec.com/news/20874/): The leading international trade fair for power electronics will once again take place in Nuremberg from June 11 - 13, 2024: PCIM. The focus there will be on professional exchange about new products, the latest trends and current research results. Our experts will be there to present HALA's comprehensive expertise in optimizing thermal management solutions and thermal interfaces. At our stand 505 in the central Hall 7, visitors can find out about our current portfolio in the field of high-performance interface materials, innovative pyrolytic and phase change graphite solutions, heat pipe assemblies and pulsating heat pipes. Of course, we will also be presenting our sustainable thermal management solutions for areas such as e-mobility, mobile communications and others. These solutions help to increase the efficiency of applications, thereby promoting sustainability and climate protection. You are welcome to make an appointment in advance. We look forward to your visit! - [PRODUCT OF THE MONTH – MAY 2024](https://www.hala-tec.com/news/product-of-the-month-may-2024/): TFO-ZS-SI is an excellent electrically insulating, thermally conductive silicone film that has been specially developed for the thermal connection of electronic components to cooling surfaces. This film sets new standards in terms of thermalmanagement! - [PRODUCT OF THE MONTH – APRIL 2024](https://www.hala-tec.com/news/product-of-the-month-april-2024/): Today I present to you an incredible material called TGF-NSS-NS that is rewriting the rules of the game for thermalmangement in the electronics industry! - [PRODUCT OF THE MONTH – MARCH 2024](https://www.hala-tec.com/news/product-of-the-month-march-2024/): Ready to turn up the heat on your applications? Meet TGF-AXS-SI-GF – the ultra-soft electrically insulating, thermally conductive silicone gap filler pad that's here to revolutionize thermal management! - [PRODUCT OF THE MONTH – FEBRUARY 2024](https://www.hala-tec.com/news/product-of-the-month-february-2024/): Heard about TGF-YSP-SI? This amazing gap filling pad is a true game-changer in the world of electronic components, delivering some seriously hot results! - [PRODUCT OF THE MONTH – JANUARY 2024](https://www.hala-tec.com/news/product-of-the-month-january-2024/): TGF-MUS-SI is an electrically insulating, thermally conductive silicone gapfiller that plays a pivotal role in addressing the challenges of thermalmanagement,❗️especially in applications with substantial gaps due to tolerances or varying stack-up heights. This silicone elastomer, uniquely formulated with ceramic particles, offers an impressive thermal conductivity, effectively minimizing overall thermal resistance. - [PRODUCT OF THE MONTH – DECEMBER 2023](https://www.hala-tec.com/news/product-of-the-month-december-2023/): 🔥 Elevate your thermal management game with our cutting-edge Vapor Chamber (VC) technology! 🌡️ - [PRODUCT OF THE MONTH – NOVEMBER 2023](https://www.hala-tec.com/news/product-of-the-month-november-2023/): 🔥 Introducing TGF-USS-SI: The ultimate solution for enhanced #Thermalmanagement! 🔌🌡️ - [PRODUCT OF THE MONTH – OCTOBER 2023](https://www.hala-tec.com/news/product-of-the-month-october-2023/): Discover the full potential of thermal management with TGF-WP-SI. - [Welcome to the team!](https://www.hala-tec.com/news/welcome-to-the-team/): On September 1, 2023 we were pleased to welcome our new trainee Mr. Suddoth. We are very happy that you are part of our HALA team as of today. For your start with us, we wish you all the best and look forward to working together.   Picture: f.l. Toni Suddoth (trainee), Marco Ragucci (trainer) - [PRODUCT OF THE MONTH – SEPTEMBER 2023](https://www.hala-tec.com/news/product-of-the-month-september-2023/): 📢 Discover the advantages of TGL-U-NS, the solution for excellent thermal connections over long distances. 🌡️💡 - [PRODUCT OF THE MONTH – AUGUST 2023](https://www.hala-tec.com/news/product-of-the-month-august-2023/): 📢 We introduce: TFO-R-SI, the new solution for thermal connection of electronic components to cooling surfaces, for example in #inverters, #PowerSupplies, #UPS equipment, motor controls, #SolarTechnology or auxiliary heaters in the #automotive sector. 🌡️💡 - [E-MOBILITY – THE FUTURE ON FOUR WHEELS](https://www.hala-tec.com/news/e-mobility-the-future-on-four-wheels/): E-mobility is becoming more and more popular, and for good reason! Especially in the area of company vehicles, e-mobility has gained a lot of importance. We also recognize the advantages of electric vehicles and are gradually deciding to switch to E-mobility. ⚡ - [PRODUCT OF THE MONTH – JULY 2023](https://www.hala-tec.com/news/product-of-the-month-july-2023/): TGL-X-SI is an electrically insulating, thermally conductive, highly viscous and dispensable form-in-place GapFiller that is ideal for making optimum thermal connections, even at large gaps. No more worrying about height differences between electronic components or large tolerances! 🙌 💪 - [PRODUCT OF THE MONTH – JUNE 2023](https://www.hala-tec.com/news/product-of-the-month-june-2023/): Say goodbye to overheating problems and hello to efficient heat dissipation! - [PCIM 2023: High attention at Hala’s booth](https://www.hala-tec.com/news/pcim-2023-high-attention-at-halas-booth/): Once again, intensive and stimulating discussions with many professional visitors characterized our trade show days at PCIM Europe from May 09 to 11 in Nuremberg. At this point we would like to thank all people who found the opportunity to visit us at our booth. - [Optimizing sustainability and efficiency](https://www.hala-tec.com/news/optimizing-sustainability-and-efficiency/): Our Managing Director, Dr. Wilhelm Pohl, is currently on a trip to Japan with his colleagues Michael Stoll and Olivier Le Gal. Their mission is to work on the HALA products of the future together with their business partners there. Their mode of action - especially regarding the maximization of their #ThermalConductivity - is one of the focal points. At the same time, the focus is also on ways to optimize processes and the supply chain. We want to make both more efficient and, above all, more sustainable. In doing so, we are guided by Scopes 1 (direct emissions), 2 (indirect emissions from purchased energy) and 3 (indirect emissions within the value chain) of the #GHGProtocol for holistic #ClimateProtection, which will be reflected in our #sustainability reports in the future. ## Categories